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Silicon wafer grinding processing
Silicon wafer grinding processing Outer diameter 90 mm Grinding of holes with diameters of φ36 mm and φ18 mm Chamfering on the top and bottom surfaces Produced as a prototype.
Leave the precision processing of semiconductor wafers to us.
In the semiconductor industry, wafers are crucial components that serve as the foundation for electronic devices. The quality of the wafers significantly affects the performance of the final products, necessitating precise processing. In particular, dimensional accuracy, surface roughness, and hole processing precision are critical; even slight deviations from the standards can lead to decreased device performance or the occurrence of defective products. Our company contributes to improving the quality of our customers' products through the precision processing of silicon wafers. 【Usage Scenarios】 - Manufacturing of semiconductor wafers - Manufacturing of electronic components - Research and development 【Benefits of Implementation】 - Provision of high-quality wafers - Improvement of yield - Enhancement of product reliability
